Surface mount assembly (SMT) has a crucial role to play within the New Product Introduction (NPI) process for electronics manufacturing. The top a higher level automation inside the SMT methodology provides a number of advantages, from automatic correction of errors, to simpler and faster assembly, better mechanical performance, increased production rates and reduced labour costs. The SMT assembly process on an electronics manufacturing services (EMS) provider may be broken down into four key stages: Solder Paste Printing Pick and set Oven Profiling Automated Optical Inspection (AOI) With regards to the complexity of the design, or perhaps your own outsourcing strategy, your product could go through all these processes subsequently, or else you may find that you just omit a measure or two. You want to highlight the actual attributes, as well as the vital importance, from the solder paste printing process for your NPI. Attempting to your specifications The initial step for your EMS provider can be to analyse the printed circuit board (PC data that is certainly specific in your order, to ensure they find the required stencil thickness and the the best option material. Solder past

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